Molex has introduced a thermal management solution that decreases the time and cost of deploying and upgrading high-performance data centres to meet unrelenting demand for generative AI and machine learning workflows. Molex VaporConnect Opt

Molex | 27-09-2024

Helvar has announced the official commercial launch of Helvar Senses, an advanced environmental sensing solution integrated into lighting controls. Building on insights gained from pilot projects across diverse industries, including success

Helvar | 04-09-2024

Master Bond EP21ARHTND-2 is a two-part epoxy adhesive developed to withstand prolonged chemical exposure. "The system's chemical resistance was successfully tested in chemicals such as 98% sulphuric acid, 25% hydrochloric acid, 20% phosphor

Masterbond | 19-08-2024

The Chomerics Division of Parker Hannifin Corporation has released its new THERM-A-GAP PAD 30 thermally conductive gap filler pads, a high-performance solution for EV battery packs that fits seamlessly into robotic assembly processes typica

Parker Chomerics | 30-07-2024

Laird Thermal Systems has released a new high-performance thermoelectric cooler assembly series that uses next-generation thermoelectric coolers with advanced semiconductor materials. This enhancement boosts cooling performance by up to 10%

Laird | 11-06-2024

Power Integrations has launched the SCALE-iFlex XLT family of dual-channel plug-and-play gate drivers for operation of single LV100 (Mitsubishi), XHP 2 (Infineon), HPnC (Fuji Electric) and equivalent semiconductor modules up to 2300V blocki

Power Integrations | 30-05-2024

Power supply designers, grappling with thermal challenges as power levels surge, often find traditional heat reduction methods impractical due to size, layout, or cost constraints. The TMJ series, with its compact size and cost-effectivenes

Stackpole | 20-05-2024

CUI Devices’ Thermal Management Group has announced the expansion of its BGA heat sinks line. Compatible with BGA devices, the HSB family now offers aluminium or copper material options, clean or black anodised material finishes, and adhesi

CUI Devices | 14-05-2024

FLIR, a Teledyne Technologies company, has released the FLIR CM276 professional clamp meter with infrared imaging, a visual camera, and solar PV DC built for electrical test and measurement. The device empowers electrical professionals to t

Teledyne FLIR | 05-03-2024

Littelfuse, Inc. has introduced TTape, a groundbreaking overtemperature detection platform designed to transform the management of Li-ion battery systems. With its innovative features and unparalleled benefits, the platform helps vehicle sy

Littelfuse | 16-01-2024

The Chomerics Division of Parker Hannifin Corporation has released two high-performance, high-reliability, fully cured dispensable thermal gels. The new THERM-A-GAP GEL 35VT and THERM-A-GAP GEL 50VT conduct heat away from electronics to hea

Parker Chomerics | 08-12-2023

Fluke has developed a range of thermal imaging and wireless testing tools to ensure safety is the highest priority for engineers working in potentially dangerous arc flash zones. Every company's electrical safety strategy should be based

Fluke | 06-11-2023

CUI Devices' Thermal Management Group has launched its new thermal design services. With a team of thermal management experts, its industry-leading thermal design services employ advanced simulation tools and decades of expertise to determi

CUI Devices | 13-10-2023

The Chomerics Division of Parker Hannifin Corporation is launching SOFT-SHIELD 3800, an electrically conductive fabric over silicone foam EMI shielding and electrical grounding gasket for low closure force and high-temperature electronics a

Parker Hannifin plc | 11-10-2023